The 58th IEEE/ACM International Symposium on Microarchitecture® (MICRO) will conduct artifact evaluation (AE) this year. AE has become a common practice in the systems community (OSDI, PLDI, PACT, MLSys), and has recently been successfully introduced to the architecture community, with ASPLOS conducting AE in the last six years, and MICRO doing so as well in 2021. We invite the authors of accepted MICRO 2025 papers to submit their artifacts to be assessed based on the ACM Artifact Review and Badging policy. Note that this submission is voluntary and will not influence the final decision regarding the papers.

Upload Artifact Submissions to HotCRP

Important Dates

  • Paper Decision Notification: July 14, 2025
  • Artifact Registration (Intent to Submit): July 27, 2025 at 11:59 PM PDT
  • Artifact Submission: August 3, 2025 at 11:59 PM PDT
  • Artifact Decision: August 31, 2025

Process

The authors of accepted papers at MICRO 2025 will be invited to submit their artifacts according to the established submission guidelines. Submission will be then reviewed according to the reviewing guidelines. Papers that successfully go through AE will receive a set of ACM badges of approval printed on the papers themselves and available as meta information in the ACM Digital Library (it is now possible to search for papers with specific badges in ACM DL). Authors of such papers will have an option to include a two-page-max artifact appendix to their camera-ready paper. The optional artifact appendix pages will be free of charge.

ACM Reproducibility Badges

ACM Badge: Artifacts Available
Artifacts Available
ACM Badge: Artifacts Evaluated
Artifacts Evaluated — Functional
ACM Badge: Results Reproduced
Results Reproduced

Artifact Submission

An artifact submission consists of two parts:

  1. The paper and a two-page appendix. Please prepare your appendix using the provided template. The appendix is expected to contain the following main sections:
    • an abstract
    • an itemized metainformation list
    • access to the artifact
    • system requirements and dependencies
    • experiment workflow
    • steps for evaluation
    • results
    Note that the paper does not need to be the final version, as the main goal of this submission is to let artifact reviewers reproduce your experiments.
  2. The artifact. Please make your artifact accessible by the reviewing committee. We do not limit the way of code deliveryi (e.g., GitHub, Docker, or VM image). However, if you would like to apply for the "Artifact Available" badge, your artifact must be placed on a publicly accessible archival repository, such as Zenodo, FigShare, or Dryad. For more details, please refer to the reviewing guide.

Please submit your artifact on our submission site. When you submit, please provide details about the artifact's software and hardware requirements. This will be extremely helpful for the Artifact Evaluation Committee to find suitable reviewers.

Benefits

There are major benefits to introducing AE in our conferences.

  1. Dissemination of Ideas: The goal of our research is to disseminate insights and encourage people to build upon that idea. Open-sourcing the artifacts and opening up the ideas to the whole community ensures that the community can work together towards solving an important problem.
  2. Reproducibility of the Results: Artifact evaluation promotes reproducibility of experimental results and encourages code and data sharing to help the community quickly validate and compare alternative approaches.
  3. Safeguarding the Review Process: AE incentivizes people to conduct research in an ethical manner. The recent example of misconduct in our conference reviewing process has greatly hurt the reputation of this community. Introducing AE can help to restore our integrity and commitment to reproducible and ethical research.

Artifact Evaluation Organization

Artifact Evaluation Co-Chairs Affiliation
Eojin Lee Inha University
Ting-Jung Chang National Yang-Ming Chiao-Tung University

Artifact Evaluation Committee

Committee Member Affiliation
Abdelrahman Hussein Simon Fraser University
Aman Sinha Institute of Electronics, National Yang Ming Chiao Tung University
Amel Fatima University of Virginia
Avilash Mukherjee University of British Columbia
Avinash Kumar The University of Texas at Austin
Chang Liu Tsinghua University
Changhun Oh KAIST
Deepanjali Mishra Carnegie Mellon University
Devansh Jain University of Illinois at Urbana-Champaign (UIUC)
Dongjae Lee KAIST
Dongwook Kim Yonsei University
Fei Gui Tsinghua University
Filippo Carloni CNIT, Politecnico Di Milano
Gaosheng Liu University of Trento
Giannis Roumpos IMDEA Software Institute
Helya Hosseini University of Maryland
Hyegang Son Korea University
Jianchao Yang National University of Defense Technology
Jinwoo Hwang KAIST
Joao Paulo Cardoso de Lima Dresden University of Technology
Jungwoo Kim Stanford
Juntaek Lim KAIST
Keisuke Kamahori University of Washington
Konstantinos Kanellopoulos ETH Zurich
Kyoungho Jeun Inha University
Le Qin The Hong Kong University of Science and Technology (Guangzhou)
Lucas Henrique Morais Hewlett Packard Enterprise and Universitat Politècnica de Catalunya
MKP Madushanka General sir John kotelawala Defence University
Manoj Vishwanathan Purdue University
Mehdi Safarpour Oulu
Mian Qin Broadcom
Ruihao Li The University of Texas at Austin
SONAM Indraprastha Institute of Information Technology Delhi (IIITD)
Saber Ganjisaffar University of California, Riverside
Sanjali Yadav University of Maryland
Seonjin Na Georgia Tech
Shashank Nag The University of Texas at Austin
Shengyu Fan UCAS
Sirajus Salekin Extron Electronics
Sungjun Cho POSTECH
Sunho Lee KAIST
Varun Darshana Parekh The Pennsylvania State University
Venkata Kalyan Tavva Indian Institute of Technology Ropar
Weihong Xu EPFL
Won Joon Yun University of Texas at Austin
Wonung Kim KAIST
Xianglong Deng Institute of Information Engineering, Chinese Academy of Sciences
Xin Zhang Peking University
YUAN FENG UC MERCED
Yankai Jiang Northeastern University
Yao Hsiao Stanford University
Yinan Xu Institute of Computing Technology, Chinese Academy of Sciences
Yuewen Hou University of Michigan
Zihan Chen Rutgers University