The 46th Annual IEEE/ACM International Symposium on Microarchitecture, 2013

MICRO-46 Keynote

Die Stacking is Happening

Bryan Black
AMD

Presentation: PDF

Abstract:
This talk will start with a sample die stacking technology flow illustrating interesting interactions between technology and design. It will then explain why, after more than 10 years of development, die stacking is finally happening in mainstream computing. The talk will close with an outline of how die stacking is going to impact the industry. Along the way perhaps some exciting areas of research will be discussed.

Bio:
Bryan Black received his Ph.D. from Carnegie Mellon. With over 20 years of experience Black has had the honor of working at Motorola, Intel, and AMD. He has done a little of everything from devices to circuits to microarchitecture to DRAM to test to packaging. Black is currently a Senior AMD Fellow and runs the AMD die stacking program.